Electronic Equipment

Browse our inventory of electronic equipment. You can search using our search tool to the right. and add the specific equipment to “My Equipment List” and hit the “Request Info” button. We will then reach out to you to you as soon as possible.

Model name: Advanced Ace 300 | Manufacturer: Kokusaii

RMMT21242

  • Model Name: Advanced Ace 300
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Traditional Furnaces / Diffusion Systems
  • Type: Vertical POLY Furnance
  • Manufacturer: Kokusai
  • Location: SINGAPORE

Model name: AFR-01 | Manufacturer: Sunyangi

RMMT21198

  • Model Name: AFR-01
  • Wafer Size: N/A
  • Date Available: 20/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Die Sort
  • Type:
  • Manufacturer: Sunyang
  • Location: MALAYSIA

Model name: Altus LFW | Manufacturer: Lam Researchi

RMMT21206

  • Model Name: Altus LFW
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 27/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Deposition Equipment
  • Type: Multi-Process CVD
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: Archer 300 Plus | Manufacturer: KLA-Tencori

RMMT21126

  • Model Name: Archer 300 Plus
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Metrology Equipment
  • Type: Overlay Measurement System
  • Manufacturer: KLA-Tencor
  • Location: SINGAPORE

Model name: Atlas M | Manufacturer: IXRF Systemsi

RMMT21008

  • Model Name: Atlas M
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: X-Ray Inspection Equipment
  • Type: Automatic X-Ray Inspection System
  • Manufacturer: IXRF Systems
  • Location: SINGAPORE

Model name: Atlas M | Manufacturer: IXRF Systemsi

RMMT21009

  • Model Name: Atlas M
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: X-Ray Inspection Equipment
  • Type: Automatic X-Ray Inspection System
  • Manufacturer: IXRF Systems
  • Location: SINGAPORE

Model name: Bestem D-02H | Manufacturer: Canon Machineryi

RMMT20793

  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Epoxy Die Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D-02H | Manufacturer: Canon Machineryi

RMMT20821

  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Epoxy Die Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D-02H | Manufacturer: Canon Machineryi

RMMT20824

  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Epoxy Die Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D-02H | Manufacturer: Canon Machineryi

RMMT20831

  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Epoxy Die Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D-02H | Manufacturer: Canon Machineryi

RMMT20832

  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Epoxy Die Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D-02H | Manufacturer: Canon Machineryi

RMMT21187

  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 12/19/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Epoxy Die Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D-02H | Manufacturer: Canon Machineryi

RMMT21188

  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 12/19/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Epoxy Die Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20734

  • Model Name: Bestem D531t
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20735

  • Model Name: Bestem D531t
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20736

  • Model Name: Bestem D531t
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20737

  • Model Name: Bestem D531t
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20738

  • Model Name: Bestem D531t
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20763

  • Model Name: Bestem D531t
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Centris G5 Mesa | Manufacturer: Applied Materialsi

RMMT20687

  • Model Name: Centris G5 Mesa
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 14/09/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Applied Materials
  • Location: SINGAPORE