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MANUFACTURER	PROCESS	WAFER
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VIEW	MANUFACTURER	MODEL	DESCRIPTION	PROCESS	WAFER	TOOL ID
	ACT-CMI	1000	PHOTORESIST STRIPPER AND SINK	WET PROCESS	200	D214606
	ADE	Ultra Gauge 9500	THICKNESS GAUGE	INSPECTION & METROLOGY	200	D214411
	ADVANTEST	T3343	TEST SYSTEM	TEST & PROBE	200	D112018
	ADVANTEST	T3343	TEST SYSTEM	TEST & PROBE	200	D112020
	ADVANTEST	T3343	TEST SYSTEM	TEST & PROBE	200	D112021
	ADVANTEST	T3347A	TEST SYSTEM	TEST & PROBE	200	D214618
	ADVANTEST	T3347A WEAL25	TEST SYSTEM	TEST & PROBE	200	D214469
	ADVANTEST	TAKEDA T3340	TESTER	TEST & PROBE	150	TAKEDA-1
	ADVANTEST	TAKEDA T3340	TESTER	TEST & PROBE	150	TAKEDA-10
	ADVANTEST	TAKEDA T3340	TESTER	TEST & PROBE	150	TAKEDA-2
	ADVANTEST	TAKEDA T3340	TESTER	TEST & PROBE	150	TAKEDA-5
	ADVANTEST	TAKEDA T3340	TESTER	TEST & PROBE	150	TAKEDA-7
	AG ASSOCIATES	8108	Heatpulse RTP	OXIDATION / DIFFUSION / ANNEAL	200	RTP702
	AG ASSOCIATES	HEATPULSE 8108	RTP	DEPOSITION	150	AST-8108B-ATA2
	AKRION	SA-2000	SEMIAUTOMATIC WET-BENCH	WAFER SORT & HANDLING	150	BANO-PLATINO
	ALPHA INNOTECH CORPORATION	FA-1000	Emission Microscopy, Microscope	INSPECTION & METROLOGY	200	D214620
	APPLIED MATERIALS	5500 ENDURA	SPUTTER	DEPOSITION	200	SPT708
	APPLIED MATERIALS	5500 Endura	PVD System	DEPOSITION	150	AMT-END-AG3
	APPLIED MATERIALS	5500 Endura PVD Copper SIP	Endura Electra Cu	DEPOSITION	200	SPA25
	Applied Materials	5500 Endura PVD Copper SIP	Endura Electra Cu	DEPOSITION	200	SPA26
	APPLIED MATERIALS	CENTURA 5200	3 Chamber eMxP+ Oxide Etch System	ETCH	200	D214177
	APPLIED MATERIALS	CENTURA 5200	3 Chamber eMxP+ Oxide Etch System	ETCH	200	D214175
	APPLIED MATERIALS	CENTURA 5200	3 Chamber MxP Poly Etch System	ETCH	200	D214174
	APPLIED MATERIALS	CENTURA 5200 TPCC RTP	2 Chamber XE+ RTP	DEPOSITION	200	D214363
	APPLIED MATERIALS	CENTURA 5200 WxZ	CENTURA WxZ	DEPOSITION	200	AMT-5200/WxZ-ISA1
	APPLIED MATERIALS	CENTURA 5200 XEPLUS	XEPLUS RTP, HTF Poly mainframe	DEPOSITION	200	AMI-RTP-AOA2
	APPLIED MATERIALS	CENTURA II eMax	4 Ch EMAX Oxide Etch	ETCH	200	CENTF52
	APPLIED MATERIALS	CENTURA II eMax	4 Ch EMAX Oxide Etch	ETCH	200	CENTF53
	APPLIED MATERIALS	CENTURA II eMax	4 Ch EMAX Oxide Etch	ETCH	200	CENTF54
	APPLIED MATERIALS	CENTURA II eMax	EMAX Oxide Etch - 4 Chambers	ETCH	200	CENTF55
	APPLIED MATERIALS	CENTURA TPCC RADIANCE DPN	RTP Salicide -XE 4 Chambers DPN	OXIDATION / DIFFUSION / ANNEAL	200	RTA03
	APPLIED MATERIALS	CENTURA TPCC RTP RADIANCE DPN	RTP Salicide -XE 4 Chambers DPN	OXIDATION / DIFFUSION / ANNEAL	200	RTS03
	APPLIED MATERIALS	CHAMBER	PVD De-gas wide body	DEPOSITION	200	AMI-PVD1-AOA2
	APPLIED MATERIALS	ENDURA 5500	ENDURA HP+	DEPOSITION	200	AMT-5500/2-ISA1
	APPLIED MATERIALS	Mirra Mesa	Mirra Mesa - Cu CMP System	CMP	200	CMA25
	Applied Materials	MirraMesa	CMP - Cu Polisher System	CMP	200	CMA26
	APPLIED MATERIALS	P-5000 MARK II	MXP ETCH	ETCH	200	AMT-5000-ISA1
	APPLIED MATERIALS	P5000	AMI-5000-PETEOS w/ PLIS	DEPOSITION	150	AMICVD-11
	APPLIED MATERIALS	P5000	AMI-5000-PETEOS	DEPOSITION	150	AMI-CVD-3
	APPLIED MATERIALS	P5000	DSAD ILD	CVD	200	AMS03
	APPLIED MATERIALS	P5000	SACVD ILD	CVD	200	AMZ01
	APPLIED MATERIALS	P5000	PSG ILD 0	CVD	200	AMS004
	APPLIED MATERIALS	P5000	STI DEP ETCH	CVD	200	STI004
	APPLIED MATERIALS	P5000	PSG ILD 0	CVD	200	AMS006
	APPLIED MATERIALS	P5000	STI DEP ETCH	CVD	200	STI005
	APPLIED MATERIALS	P5000	PSG ILD 0	CVD	200	AMS002
	APPLIED MATERIALS	P5000	STI DEP ETCH	CVD	200	STI002
	APPLIED MATERIALS	P5000	PSG ILD 0	CVD	200	AMS008
	APPLIED MATERIALS	P5000	DSAD ILD	CVD	200	AMS007
	APPLIED MATERIALS	P5000 Mark II	3 Chamber SACVD BGSG	DEPOSITION	200	D214197

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